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  2. Flux (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Flux_(metallurgy)

    Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

  3. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]

  4. List of brazing alloys - Wikipedia

    en.wikipedia.org/wiki/List_of_brazing_alloys

    Suitable for step soldering. The original flux-less alloy, does not need flux. ... Near-eutectic. General purpose alloy. ... [5] – Copper-ABA. 92.75: 2.25: 2: 3: Au ...

  5. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Sn 96.5 Ag 3.5: 221 [11] Yes: Yes: Sn 96, Sn 96.5, 96S. Fine lamellar structure of densely distributed Ag 3 Sn. Annealing at 125 °C coarsens the structure and softens the solder. [51] Creeps via dislocation climb as a result of lattice diffusion. [72] Used as wire for hand soldering rework; compatible with SnCu 0.7, SnAg 3 Cu 0.5, SnAg 3.9 Cu ...

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  7. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    The paste manufacturer will suggest a suitable reflow temperature profile to suit their individual paste. The main requirement is a gentle rise in temperature to prevent explosive expansion (which can cause "solder balling"), yet activate the flux. Thereafter, the solder melts. The time in this area is known as Time Above Liquidus. A reasonably ...

  8. Wave soldering - Wikipedia

    en.wikipedia.org/wiki/Wave_soldering

    Flux in the wave soldering process has a primary and a secondary objective. The primary objective is to clean the components that are to be soldered, principally any oxide layers that may have formed. [3] There are two types of flux, corrosive and noncorrosive. Noncorrosive flux requires precleaning and is used when low acidity is required.

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