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  2. Wafer bond characterization - Wikipedia

    en.wikipedia.org/wiki/Wafer_bond_characterization

    Shear testing is the alternative method to determine the strength a bond can withstand. Various variants of shear testing exist. Like with pull testing, the objective is to recreate the failure mode of interest in the test. If that is not possible, the operator should focus on putting the highest possible load on the bond. [18]

  3. Wire bonding - Wikipedia

    en.wikipedia.org/wiki/Wire_bonding

    Non-destructive test methods are typically used for 100% testing of safety critical, high quality and high cost products, avoiding damage to the acceptable wired bonds tested. The term wire pull usually refers to the act of pulling a wire with a hook mounted on a pull sensor on a bond tester. However, to promote certain failure modes, wires can ...

  4. MIL-STD-883 - Wikipedia

    en.wikipedia.org/wiki/MIL-STD-883

    The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and ...

  5. Cable harness - Wikipedia

    en.wikipedia.org/wiki/Cable_harness

    Another popular test method for a cable harness is a 'pull test', in which the harness is attached to a machine that pulls the harness at a constant rate. This test then measures the cable harness' strength and electrical conductivity when pulled against a minimum standard to ensure that cable harnesses are consistently effective and safe. [10]

  6. Reliability (semiconductor) - Wikipedia

    en.wikipedia.org/wiki/Reliability_(semiconductor)

    Reliability of semiconductors is kept high through several methods. Cleanrooms control impurities, process control controls processing, and burn-in (short term operation at extremes) and probe and test reduce escapes. Probe (wafer prober) tests the semiconductor die, prior to packaging, via micro-probes connected to test equipment.

  7. Pad cratering - Wikipedia

    en.wikipedia.org/wiki/Pad_cratering

    IPC-9708 provides three test methods to characterize the pad cratering of a component and PCBA: pin pull, ball pull, and ball shear testing. [5] In the pin pull test a pin is soldered to pads and pulled until fracture. It is a useful test for all pad geometries and is sensitive to board design and materials.

  8. This Is The Best Place To Put A Thermometer In A Turkey - AOL

    www.aol.com/best-place-put-thermometer-turkey...

    The same goes for deep-fried turkey—pull it out of the oil briefly to insert the thermometer. When grilling, make sure to check the temperature on the side facing away from the heat source.

  9. Pull off test - Wikipedia

    en.wikipedia.org/wiki/Pull_off_test

    A pull-off test, also called stud pull test, is a type of test in which an adhesive connection is made between a stud and a carrier (or object to be tested) by using a glue, possibly an epoxy or polyester resin, that is stronger than the bond that needs to be tested.

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