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Ability to merge new PEX with existing copper and PVC systems. Fittings that allow installers to join a copper pipe on one end with a PEX line at the other are widely available. [16] These couplings allow the installer to reduce or expand the diameter of the pipes at the transition to PEX if desired. Suitable for hot and cold pipes.
Short-radius (or regular) 45° elbow (copper sweat) Long-radius (or sweep) 90° elbow (copper sweat) An elbow is installed between two lengths of pipe (or tubing) to allow a change of direction, usually a 90° or 45° angle; 22.5° elbows are also available. The ends may be machined for butt welding, threaded (usually female), or socketed. When ...
Converting is a type of metallurgical smelting that includes several processes; the most commercially important form is the treatment of molten metal sulfides to produce crude metal and slag, as in the case of copper and nickel converting. A now-uncommon form is batch treatment of pig iron to produce steel by the Bessemer process.
Metals, like copper, nickel, lithium and cobalt, among others, are needed to transport and store clean energy needed in the transition. Copper is an efficient conductor of heat and electricity ...
Copper interconnects are used in integrated circuits to reduce propagation delays and power consumption. Since copper is a better conductor than aluminium, ICs using copper for their interconnects can have interconnects with narrower dimensions, and use less energy to pass electricity through them. Together, these effects lead to ICs with ...
In this article, the following conventions and definitions are to be understood: The Reynolds number Re is taken to be Re = V D / ν, where V is the mean velocity of fluid flow, D is the pipe diameter, and where ν is the kinematic viscosity μ / ρ, with μ the fluid's Dynamic viscosity, and ρ the fluid's density.
The BEOL process deposits metalization layers on the silicion to interconnect the individual devices generated during FEOL (bottom). CMOS fabrication process. Back end of the line or back end of line (BEOL) is a process in semiconductor device fabrication that consists of depositing metal interconnect layers onto a wafer already patterned with devices.
Metal L-edge spectroscopy is a spectroscopic technique used to study the electronic structures of transition metal atoms and complexes. This method measures X-ray absorption caused by the excitation of a metal 2p electron to unfilled d orbitals (e.g. 3d for first-row transition metals), which creates a characteristic absorption peak called the ...
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