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The CPU's clock speed and VCore are automatically decreased when the computer is under low load or idle, to save battery power, reduce heat and noise. The lifetime of the CPU is also extended because of reduced electromigration, which varies exponentially with temperature. [1] The technology is a concept similar to Intel's SpeedStep technology.
Negative-bias temperature instability (NBTI) is a key reliability issue in MOSFETs, a type of transistor aging. NBTI manifests as an increase in the threshold voltage and consequent decrease in drain current and transconductance of a MOSFET. The degradation is often approximated by a power-law dependence on time.
Accelerated life testing is the process of testing a product by subjecting it to conditions (stress, strain, temperatures, voltage, vibration rate, pressure etc.) in excess of its normal service parameters in an effort to uncover faults and potential modes of failure in a short amount of time.
These three models are the Ryzen 5 7600, Ryzen 7 7700, and Ryzen 9 7900, which feature a lower TDP of 65 W, and come bundled with stock coolers, unlike the X-suffix processors. [ 16 ] [ 17 ] The Ryzen 9 7900X3D and 7950X3D processors with 3D V-Cache were released on February 28, 2023, [ 18 ] followed by the Ryzen 7 7800X3D on April 6.
As the first largely "ground up redesign" of the Zen CPU core since the architecture family's original release in early 2017 with Zen 1/Ryzen 1000, Zen 3 was a significant architectural improvement over its predecessors; having a very significant IPC increase of +19% over the prior Zen 2 architecture in addition to being capable of reaching higher clock speeds.
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals.
The oven is held at constant temperature for up to one week or, until a runaway event occurs. Test "Passes" if product does not exceed test (oven) temperature by 6 °C within one week; Test "Fails" if product exceeds test temperature by 6 °C within one week; The test is repeated in 5 °C increments until a failure is reached
In computing, serial presence detect (SPD) is a standardized way to automatically access information about a memory module.Earlier 72-pin SIMMs included five pins that provided five bits of parallel presence detect (PPD) data, but the 168-pin DIMM standard changed to a serial presence detect to encode more information.