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It is used to deposit copper and other conductors in forming printed circuit boards and copper interconnects in integrated circuits. It is also used to purify metals such as copper. The aforementioned electroplating of metals uses an electroreduction process (that is, a negative or cathodic current is on the working
Excluding the continuous strip plating industry, copper is the second most commonly-plated metal after nickel. [6] Copper electroplating offers a number of advantages over other plating processes, including low metal cost, high-conductivity and high-ductility bright finish, and high plating efficiency.
Electroplating of zinc was invented in 1800 but the first bright deposits were not obtained until the early 1930s with the alkaline cyanide electrolyte. Much later, in 1966, the use of acid chloride baths improved the brightness even further. The latest modern development occurred in the 1980s, with the new generation of alkaline, cyanide-free ...
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Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [19]
That is, the electroplating processes applied to the component parts were taxed, and then the same processes were re-taxed in the sale of the final product. In July, Erie Plating Company filed a petition for reassessment, a hearing was held in January of the following year, and three months later the Bureau reaffirmed its assessments.
Electroless nickel plating, covered by a thin layer of gold, is used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improving the solderability of copper contacts and plated through holes and vias. The gold is typically applied by quick immersion in a solution containing gold salts.
The processed surface is then coated with electroless copper or nickel before further plating. This process gives useful (about 1 to 6 kgf /cm or 10 to 60 N /cm or 5 to 35 lbf /in) adhesion force, but is much weaker than actual metal-to-metal adhesion strength.