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Diagram of a laser cutter Laser cutting process on a sheet of steel CAD (top) and stainless steel laser-cut part (bottom) Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and ...
Standard semiconductor manufacturing uses a "dicing after thinning" approach, where wafers are first thinned before they are diced. The wafer is ground down in a process called back side grinding (BSG) before it is diced. [1] The size of the die left on the tape may range from 35 mm on a side (very large) to 0.1 mm square (very small).
Lasers are used in optical disc drives, laser printers, barcode scanners, DNA sequencing instruments, fiber-optic and free-space optical communications, semiconductor chip manufacturing (photolithography, etching), laser surgery and skin treatments, cutting and welding materials, military and law enforcement devices for marking targets and ...
where t is the depth of cut, P is the laser beam power, v is the cutting velocity, and d is the laser beam spot diameter. [5] The depth of the cut is also influenced by the workpiece material. The material's reflectivity, density, specific heat, and melting point temperature all contribute to the lasers ability to cut the workpiece.
With cut-and-capture, a cap coated with an adhesive is positioned directly on the thinly cut (5-8 μm) tissue section, the section itself resting on a thin membrane (polyethylene naphthalene). An IR laser gently heats the adhesive on the cap fusing it to the underlying tissue and an UV laser cuts through tissue and underlying membrane.
Laser types with distinct laser lines are shown above the wavelength bar, while below are shown lasers that can emit in a wavelength range. The height of the lines and bars gives an indication of the maximal power/pulse energy commercially available, while the color codifies the type of laser material (see the figure description for details).
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