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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors . A BGA can provide more interconnection pins than can be put on a dual in-line or flat package .
Ball grid arrays (BGA) and chip scale packages (CSA) present special difficulties for testing and rework, as they have many small, closely spaced pads on their underside which are connected to matching pads on the PCB. Connecting pins are not accessible from the top for testing, and cannot be desoldered without heating the whole device to the ...
Fine-pitch ball-grid array: A square or rectangular array of solder balls on one surface [3] LBGA: Low-profile ball-grid array: Also known as laminate ball-grid array [3] TEPBGA: Thermally-enhanced plastic ball-grid array: CBGA: Ceramic ball-grid array [3] OBGA: Organic ball-grid array [3] TFBGA: Thin fine-pitch ball-grid array [3] PBGA ...
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
Package on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them.
In the assembly of integrated circuit packages to printed circuit boards, a head-in-pillow defect (HIP or HNP), also called ball-and-socket, [1] is a failure of the soldering process. For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may ...
CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands ...
The substrate can have a Ball Grid Array (BGA) on its underside. The substrate makes the connections to the die available for use by the PCB. [ 11 ] Substates made with build up film such as Ajinomoto Build up Film (ABF), are manufactured around a core, and the film is stacked on the core in layers by vacuum lamination at high temperatures.