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A ball grid array (BGA) is a type of surface-mount packaging ... Typically, plastic BGA devices more closely match PCB thermal characteristics than ceramic devices.
Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN , but mating is by spring pins within a socket rather than solder.
The first area array package was a ceramic pin grid array package. [1] Not long after, the plastic ball grid array (BGA), another type of area array package, became one of the most commonly used packaging techniques.
The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA). ... (open, and not sealed), and either a ceramic or plastic lid. It is usually ...
The later pin grid array (PGA) and ball grid array ... 80-pin ceramic quad flat package (TQFP) – ST6 microcontroller. The basic form is a flat rectangular (often ...
Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable. CPU sockets are used on the motherboard in desktop and server computers. Because they allow easy swapping of components, they are also used for prototyping new circuits.
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale ...