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Extreme ultraviolet lithography (EUVL, also known simply as EUV) is a technology used in the semiconductor industry for manufacturing integrated circuits (ICs). It is a type of photolithography that uses 13.5 nm extreme ultraviolet (EUV) light from a laser-pulsed tin (Sn) plasma to create intricate patterns on semiconductor substrates.
Photolithography (also known as optical lithography) is a process used in the manufacturing of integrated circuits. It involves using light to transfer a pattern onto a substrate, typically a silicon wafer. The process begins with a photosensitive material, called a photoresist, being applied to the substrate.
Beyond the models used for RET and OPC, computational lithography attempts to improve chip manufacturability and yields such as by using the signature of the scanner to help improve accuracy of the OPC model: [8] polarization characteristics of the lens pupil, Jones matrix of the stepper lens, optical parameters of the photoresist stack ...
Although EUV has been projected to be the next-generation lithography of choice, it could still require more than one lithographic exposure, due to the foreseen need to first print a series of lines and then cut them; a single EUV exposure pattern has difficulty with line end-to-end spacing control. [12]
Negative photoresists are composed of a poly(cis-isoprene) matrix, xylene solvent, and bis-arylazide as the photoactive compound. Negative photoresists react to light by polymerizing. The unexposed portions can be removed by using a developer solution. negative resist has better adhesion and is great for features greater than 2 μm in size.
By virtue of the linearity property of optical non-coherent imaging systems, i.e., . Image(Object 1 + Object 2) = Image(Object 1) + Image(Object 2). the image of an object in a microscope or telescope as a non-coherent imaging system can be computed by expressing the object-plane field as a weighted sum of 2D impulse functions, and then expressing the image plane field as a weighted sum of the ...
An illustration of OPC (Optical Proximity Correction). The blue Γ-like shape is what chip designers would like printed on a wafer, in green is the pattern on a mask after applying optical proximity correction, and the red contour is how the shape actually prints on the wafer (quite close to the desired blue target).
Immersion lithography is a technique used in semiconductor manufacturing to enhance the resolution and accuracy of the lithographic process. It involves using a liquid medium, typically water, between the lens and the wafer during exposure.