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The PCB of a quartz watch. The clock IC is under the drop of black epoxy. Chip on board (COB) is a method of circuit board manufacturing in which integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. [1]
Surface-mounted LEDs are frequently produced in chip on board (COB) arrays, allowing better heat dissipation than with a single LED of comparable luminous output. [61] The LEDs can be arranged around a cylinder, and are called "corn cob lights" because of the rows of yellow LEDs.
Non-SMD types of LED lighting also exist, such as COB (chip on board) and MCOB (multi-COB). Surface-mounted device LED modules are described by the dimensions of the LED package. A single multicolor module may have three individual LEDs within that package, one each of red, green and blue, to allow many colors or shades of white to be selected ...
In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package. COF: Chip-on-flex: Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill ...
A 230-volt LED filament lamp, with an E27 base. The filaments are visible as the eight yellow vertical lines. An assortment of LED lamps commercially available in 2010: floodlight fixtures (left), reading light (center), household lamps (center right and bottom), and low-power accent light (right) applications An 80W Chips on board (COB) LED module from an industrial light luminaire, thermally ...
Simple LED (Light Emitting Diode) circuit diagram. In electronics, an LED circuit or LED driver is an electrical circuit used to power a light-emitting diode (LED). The circuit must provide sufficient current to light the LED at the required brightness, but must limit the current to prevent damaging the LED.
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Surface-mounted LEDs are frequently sold in chip-on-board (COB) configurations. In these, the individual diodes are mounted in an array that allows the device to produce a greater amount of luminous flux with greater ability to dissipate the resulting heat in an overall smaller package than can be accomplished by mounting LEDs, even surface ...
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