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2. Adhesive bonding of semiconductor wafers - Wikipedia

   en.wikipedia.org/wiki/Adhesive_bonding_of...

   Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]

3. Wafer bonding - Wikipedia

   en.wikipedia.org/wiki/Wafer_bonding

   Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...

4. Wafer-level packaging - Wikipedia

   en.wikipedia.org/wiki/Wafer-level_packaging

   Wafer-level chip scale packaging (WL-CSP) is the smallest package currently available on the market and is produced by OSAT (Outsourced Semiconductor Assembly and Test) companies, such as Advanced Semiconductor Engineering (ASE). [4]

5. Adhesive bonding - Wikipedia

   en.wikipedia.org/wiki/Adhesive_bonding

   Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...

6. Wafer bond characterization - Wikipedia

   en.wikipedia.org/wiki/Wafer_bond_characterization

   USB Tweezers performing cold bump pull (CPB) on a bond tester. Measuring bond strength by pull testing is often the best way to get the failure mode in which you are interested. Additionally, and unlike a shear test, as the bond separates, the fracture surfaces are pulled away from each other, cleanly enabling accurate failure mode analysis.

7. Category:Packaging (microfabrication) - Wikipedia

   en.wikipedia.org/wiki/Category:Packaging_(micro...

   Adhesive bonding of semiconductor wafers; Anodic bonding; C. ... Wedge bonding; Wire bonding This page was last edited on 31 March 2013, at 21:46 (UTC). ...

8. List of manufacturing processes - Wikipedia

   en.wikipedia.org/wiki/List_of_manufacturing...

   Adhesive bonding (incomplete) Thermo-setting and thermoplastic; Epoxy; Modified epoxy; Phenolics; Polyurethane; Adhesive alloys; Miscellaneous other powders, liquids, solids, and tapes; Fastening wood and metal Nailing; Screwing (By material fastened) Machine (Metal) Wood Screws (By slot type) Phillips ("Plus sign" in Canada) Straight ("Minus ...

9. Dicing tape - Wikipedia

   en.wikipedia.org/wiki/Dicing_tape

   Dicing tape can be made of PVC, polyolefin, or polyethylene backing material with an adhesive to hold the wafer or substrate in place. In some cases dicing tape will have a release liner that will be removed prior to mounting the tape to the backside of the wafers, with a variety of adhesive strengths, designed for various wafer/substrate sizes and materials.