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In 2002, the new generation of VapoChill was released. In 2003, Asetek branched out into liquid cooling with its WaterChill brand of liquid coolers. In 2005, they released the first 12-volt pump system. [2] In the early 2000s, Chip-Con/nVENTIV and its Prometeia line of coolers emerged as the primary competitor to the Asetek Vapochill line.
EKWB Universal GPU blocks are marketed as EK-VGA Supremacy for a single graphics card setup, and a larger version called EK-Thermosphere is designed for use with more than one graphics card. These blocks only cool the GPU core and usually leave the VRAM and VRMs on a card to be cooled by air.
A water block is the watercooling equivalent of a heatsink. It is a type of plate heat exchanger and can be used on many different computer components, [1]: 186 including the central processing unit (CPU), GPU, PPU, and northbridge chipset on the motherboard. There are also Monoblocks on the market that are mounted on PC motherboards and cover ...
The company's cases used aluminum construction and were noted for their ability to house multiple radiators for liquid cooling. [4] [5] CaseLabs announced that it was shutting down permanently in August 2018, citing Trump tariffs cutting into margins by "raising prices by almost 80%", and the "default of a large account". The company said it ...
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
An earthquake with a preliminary magnitude of 3.7 struck the coast of San Francisco on Friday morning, the United States Geological Survey reported.. The earthquake occurred about three miles ...
A Washington, D.C. man has been arrested for threatening flight attendants on a United Airlines plane traveling from Houston to New Jersey. Kedus Yacob Damtew, 38, was charged with one count of ...
This provides a specification not only for ESD metal covers on two sides of VPX boards, but also for forced air, conduction- and liquid-cooling implementations. REDI also addresses spray cooling. To allow for greater power and heat dissipation, REDI includes provision for increased board-to-board spacing and increased board thickness.