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There are various wire bonding techniques (thermosonic bonding, ultrasonic bonding, thermocompression bonding) and types of wire bonds (ball bonding, wedge bonding) that affect susceptibility to manufacturing defects and reliability issues. Certain materials and wire diameters are more practical for fine pitch or complex layouts.
Originally TAB could produce finer pitch interconnections compared to flip chip, but with the development of the flip chip this advantage has diminished and has kept TAB to be a specialized interconnection technique of display drivers or similar requiring specific TAB compliant roll-to-roll (R2R, reel-to-reel) like assembly system.
Drawing of a tape-automated bonding carrier and definitions of various parts of the TAB assembly. Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier.
Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN , but mating is by spring pins within a socket rather than solder.
In "wire bonding", the chip is attached to the board with an adhesive. Each pad on the device is connected with a fine wire lead that is welded to the pad and to the circuit board. This is similar to the way that an integrated circuit is connected to its lead frame, but instead the chip is wire-bonded directly to the circuit board. [3]
The advantage of wedge bonding is a finer pitch is possible. Wedge bonding also accommodates the use of metal ribbon instead of wire for bonding. Thermocompression Bonding (TCB): The technique uses heat and pressure to create a bond between a thin wire (typically aluminum or gold) and the bonding pads. As heat softens the wire, pressure is ...
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bonding – any of several technologies that attach one electronic circuit or component to another; see wire bonding, thermocompression bonding, flip chip, hybrid bonding, etc. breadboard – a construction base for prototyping of electronics; bumping – the formation of microbumps on the surface of an electronic circuit in preparation for ...
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