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Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...
In this soldering process, heat is applied to the parts to be joined, causing the solder to melt and to bond to the workpieces in a surface alloying process called wetting. In stranded wire, the solder is drawn up into the wire between the strands by capillary action in a process called 'wicking'. Capillary action also takes place when the ...
The die is glued or soldered to the die pad inside the lead frame, and then bond wires are attached between the die and the bond pads to connect the die to the leads in a process called wire bonding. In a process called encapsulation, a plastic case is moulded around the lead frame and die, exposing only the leads.
The "welding" of cast iron is usually a brazing operation, with a filler rod made chiefly of nickel being used although true welding with cast iron rods is also available. Ductile cast iron pipe may be also "cadwelded," a process that connects joints by means of a small copper wire fused into the iron when previously ground down to the bare ...
Soft soldering uses a filler that melts at a lower temperature than the workpiece, often a lead-tin solder alloy. Brazing and hard soldering use a higher temperature filler that melts at a temperature which may approach that of the base metal, and which may form a eutectic alloy with the base metal.
No filler rod is required, the sheets form their own filler (autogenous welding). Neither is a flux used. [2] Soldering, by contrast, uses a solder alloy that is some compatible alloy showing eutectic behaviour. This gives a melting point lower than the base metal, allowing a soldering process rather than welding.
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