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Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...
In this soldering process, heat is applied to the parts to be joined, causing the solder to melt and to bond to the workpieces in a surface alloying process called wetting. In stranded wire, the solder is drawn up into the wire between the strands by capillary action in a process called 'wicking'. Capillary action also takes place when the ...
In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to ...
These techniques are usually used when the die will be wire bonded; dies with flip chip technology do not use these attachment techniques. [15] [16] IC bonding is also known as die bonding, die attach, and die mount. [17] The following operations are performed at the packaging stage, as broken down into bonding, encapsulation, and wafer bonding ...
The resulting weld is quite different in appearance from the ball bond, and is referred to as the wedge bond, tail bond, or simply as the second bond. In the final step the machine pays out a small length of wire and tears the wire from the surface using a set of clamps. This leaves a small tail of wire hanging from the end of the capillary ...
Solder (UK: / ˈ s ɒ l d ə, ˈ s ə ʊ l d ə /; [1] NA: / ˈ s ɒ d ər /) [2] is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling.
Gold wire ball-bonded to a gold contact pad. Contact pads or bond pads are small, conductive surface areas of a printed circuit board (PCB) or die of an integrated circuit. They are often made of gold, copper, or aluminum and measure mere micrometres wide. Pads are positioned on the edges of die, to facilitate connections without shorting.
During the compliant bonding cycle the bond pressure is uniquely controlled by the inherent flow properties of the aluminum compliant tape (Figure 3). Therefore, if higher bond pressures are needed to increase the final deformation (flatness) of a compliant bonded gold wire, a higher yielding alloy of aluminum could be employed.
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