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2. Thermal management (electronics) - Wikipedia

   en.wikipedia.org/wiki/Thermal_management...

   CPU heat sink with fan attached A heat sink (aluminium) incorporating a heat pipe (copper) All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. [1]

3. Heat sink - Wikipedia

   en.wikipedia.org/wiki/Heat_sink

   A heat sink (aluminum) with its heat pipes (copper) and fan (black) A heat sink (also commonly spelled heatsink, [1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of ...

4. Computer fan control - Wikipedia

   en.wikipedia.org/wiki/Computer_fan_control

   Full-tower computer cases may contain multiple cooling fans. At the top of the case is a fan controller. Fan control is the management of the rotational speed of an electric fan. In computers, various types of computer fans are used to provide adequate cooling, and different fan control mechanisms balance their cooling capacities and noise they ...

5. Computer fan - Wikipedia

   en.wikipedia.org/wiki/Computer_fan

   To cool these components, fans are used to move heated air away from the components and draw cooler air over them. Fans attached to components are usually used in combination with a heat sink to increase the area of heated surface in contact with the air, thereby improving the efficiency of cooling. Fan control is not always an automatic ...

6. Computer cooling - Wikipedia

   en.wikipedia.org/wiki/Computer_cooling

   A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.

7. Thermal interface material - Wikipedia

   en.wikipedia.org/wiki/Thermal_interface_material

   A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

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   mail.aol.com

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9. Thermal design power - Wikipedia

   en.wikipedia.org/wiki/Thermal_design_power

   Heatsink mounted on a motherboard, cooling the CPU underneath it. This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is ...