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2. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Surface-mount technology was developed in the 1960s. By 1986, surface-mounted components accounted for 10% of the market at most but were rapidly gaining popularity. [4] By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices.

3. ESP32 - Wikipedia

   en.wikipedia.org/wiki/ESP32

   ESP32 is a series of low-cost, low-power system-on-chip microcontrollers with integrated Wi-Fi and dual-mode Bluetooth.The ESP32 series employs either a Tensilica Xtensa LX6 microprocessor in both dual-core and single-core variations, an Xtensa LX7 dual-core microprocessor, or a single-core RISC-V microprocessor and includes built-in antenna switches, RF balun, power amplifier, low-noise ...

4. Radiator (engine cooling) - Wikipedia

   en.wikipedia.org/wiki/Radiator_(engine_cooling)

   a thermostat to control temperature by varying the amount of coolant going to the radiator; a fan to draw cool air through the radiator. The combustion process produces a large amount of heat. If heat were allowed to increase unchecked, detonation would occur, and components outside the engine would fail due to excessive temperature. To combat ...

5. Ball grid array - Wikipedia

   en.wikipedia.org/wiki/Ball_grid_array

   Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface ...

6. Thermostat - Wikipedia

   en.wikipedia.org/wiki/Thermostat

   The advantage of the low voltage control system is the ability to operate multiple electromechanical switching devices such as relays, contactors, and sequencers using inherently safe voltage and current levels. [15] Built into the thermostat is a provision for enhanced temperature control using anticipation.

7. Pick-and-place machine - Wikipedia

   en.wikipedia.org/wiki/Pick-and-place_machine

   Surface mount components are placed along the front (and often back) faces of the machine. Most components are supplied on paper or plastic tape, in tape reels that are loaded onto feeders mounted to the machine. Larger integrated circuits (ICs) are sometimes supplied and arranged in trays which are stacked in a compartment. More commonly used ...