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Reverse engineering of Printed circuit boards (sometimes called “cloning”, or PCB RE) is the process of generating fabrication and design data for an existing circuit board, either closely or exactly replicating its functionality. [1] Obtaining circuit board design data is not by necessity malicious or aimed at intellectual property theft ...
The Tupolev Tu-4, a Soviet bomber built by reverse engineering captured Boeing B-29 Superfortresses. Reverse engineering (also known as backwards engineering or back engineering) is a process or method through which one attempts to understand through deductive reasoning how a previously made device, process, system, or piece of software accomplishes a task with very little (if any) insight ...
Wire crossover symbols for circuit diagrams. The CAD symbol for insulated crossing wires is the same as the older, non-CAD symbol for non-insulated crossing wires. To avoid confusion, the wire "jump" (semi-circle) symbol for insulated wires in non-CAD schematics is recommended (as opposed to using the CAD-style symbol for no connection), so as to avoid confusion with the original, older style ...
A circuit diagram (or: wiring diagram, electrical diagram, elementary diagram, electronic schematic) is a graphical representation of an electrical circuit. A pictorial circuit diagram uses simple images of components, while a schematic diagram shows the components and interconnections of the circuit using standardized symbolic representations.
A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.
Schematic capture or schematic entry is a step in the design cycle of electronic design automation (EDA) at which the electronic diagram, or electronic schematic of the designed electronic circuit, is created by a designer. This is done interactively with the help of a schematic capture tool also known as schematic editor. [1]
Printed circuit boards (PCBs) are vulnerable to environmental influences; for example, the traces are corrosion-prone and may be improperly etched leaving partial shorts, while the vias may be insufficiently plated through or filled with solder. The traces may crack under mechanical loads, often resulting in unreliable PCB operation.
Decapping (decapsulation) or delidding of an integrated circuit (IC) is the process of removing the protective cover or integrated heat spreader (IHS) of an integrated circuit so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die.
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