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Quad flat no-lead : smaller footprint than leaded equivalent; Leadless chip carrier (LCC): contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration. Micro leadframe package (MLP, MLF): with a 0.5 mm contact pitch, no leads (same as QFN)
Originally meant also as part marking code, this shorthand notation is widely used in electrical engineering to denote the values of resistors and capacitors in circuit diagrams and in the production of electronic circuits (for example in bills of material and in silk screens).
Surface-mount technology was developed in the 1960s. By 1986, surface-mounted components accounted for 10% of the market at most but were rapidly gaining popularity. [4] By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices.
Populated (rear) and unpopulated (front) TSOP land patterns on a printed circuit board. A row of through-holes acting as the footprint for a pin header.. A footprint or land pattern is the arrangement of pads (in surface-mount technology) [1] or through-holes (in through-hole technology) used to physically attach and electrically connect a component to a printed circuit board.
Various resistor types of different shapes and sizes. A resistor is a passive two-terminal electrical component that implements electrical resistance as a circuit element. In electronic circuits, resistors are used to reduce current flow, adjust signal levels, to divide voltages, bias active elements, and terminate transmission lines, among other uses.
Despite their handling difficulties, and in the particular case of MELF resistors, they are still widely used in high-reliability and precision applications where their predictable characteristics (e.g., low failure rate with well-defined failure modes) as well as their higher performance in terms of accuracy, long-term stability, moisture resistance, high-temperature operation far outweigh ...
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