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Reverse engineering of Printed circuit boards (sometimes called “cloning”, or PCB RE) is the process of generating fabrication and design data for an existing circuit board, either closely or exactly replicating its functionality. [1] Obtaining circuit board design data is not by necessity malicious or aimed at intellectual property theft ...
The Tupolev Tu-4, a Soviet bomber built by reverse engineering captured Boeing B-29 Superfortresses. Reverse engineering (also known as backwards engineering or back engineering) is a process or method through which one attempts to understand through deductive reasoning how a previously made device, process, system, or piece of software accomplishes a task with very little (if any) insight ...
As an alternative, many circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. [5] Conformal coating gives most of the benefits of potting, and is lighter and easier to inspect, test, and repair. Conformal coatings can be applied as liquid or condensed from a vapor phase.
Andrew "bunnie" Huang (born 1975) is an American researcher and hacker, [1] who holds a Ph.D in electrical engineering from MIT and is the author of the freely available 2003 book Hacking the Xbox: An Introduction to Reverse Engineering.
In electronics, a continuity test is the checking of an electric circuit to see if current flows (that it is in fact a complete circuit). A continuity test is performed by placing a small voltage (wired in series with an LED or noise-producing component such as a piezoelectric speaker) across the chosen path.
Not to be confused with Printed electronics. For other uses, see PCB (disambiguation). "PC board" redirects here. For the mainboard of personal computers, see Motherboard. "Panelization" redirects here. For the page layout strategy, see N-up. Printed circuit board of a DVD player Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the ...
This is an alphabetical list of articles pertaining specifically to electrical and electronics engineering. For a thematic list, please see List of electrical engineering topics. For a broad overview of engineering, see List of engineering topics. For biographies, see List of engineers
Decapping (decapsulation) or delidding of an integrated circuit (IC) is the process of removing the protective cover or integrated heat spreader (IHS) of an integrated circuit so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die.
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