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  2. Processor power dissipation - Wikipedia

    en.wikipedia.org/wiki/Processor_power_dissipation

    When the CPU uses power management features to reduce energy use, other components, such as the motherboard and chipset, take up a larger proportion of the computer's energy. In applications where the computer is often heavily loaded, such as scientific computing, performance per watt (how much computing the CPU does per unit of energy) becomes ...

  3. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation.

  4. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.

  5. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The materials for heat sink applications should have high heat capacity and thermal conductivity in order to absorb more heat energy without shifting towards a very high temperature and transmit it to the environment for efficient cooling. [5] The most common heat sink materials are aluminium alloys. [6]

  6. Immersion cooling - Wikipedia

    en.wikipedia.org/wiki/Immersion_cooling

    Even though the expected increase in global energy consumption by data centers has remained steady, [17] there is an increased focus on energy efficiency which has driven the utilizing of liquid immersion cooling in both data centers and crypto mining operations to reevaluate its application. The advent of new very high density CPUs and GPUs ...

  7. Dynamic frequency scaling - Wikipedia

    en.wikipedia.org/wiki/Dynamic_frequency_scaling

    The dynamic power (switching power) dissipated by a chip is C·V 2 ·A·f, where C is the capacitance being switched per clock cycle, V is voltage, A is the Activity Factor [1] indicating the average number of switching events per clock cycle by the transistors in the chip (as a unitless quantity) and f is the clock frequency.

  8. AOL Mail

    mail.aol.com

    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!

  9. Intel 4004 - Wikipedia

    en.wikipedia.org/wiki/Intel_4004

    The Intel 4004 is a 4-bit central processing unit (CPU) released by Intel Corporation in 1971. Sold for US$60 (equivalent to $450 in 2023 [2]), it was the first commercially produced microprocessor, [3] and the first in a long line of Intel CPUs.

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