Search results
Results from the WOW.Com Content Network
The problem of heat transfer in the presence of liquid flowing around the body was first formulated and solved as a coupled problem by Theodore L. Perelman in 1961, [1] who also coined the term conjugate problem of heat transfer. Later T. L. Perelman, in collaboration with A.V. Luikov, [2] developed this approach further.
Each aforementioned geometry can be analyzed by three charts which show the midplane temperature, temperature distribution, and heat transfer. [1] Although Heisler–Gröber charts are a faster and simpler alternative to the exact solutions of these problems, there are some limitations. First, the body must be at uniform temperature initially.
This article describes how to use a computer to calculate an approximate numerical solution of the discretized equation, in a time-dependent situation. In order to be concrete, this article focuses on heat flow, an important example where the convection–diffusion equation applies. However, the same mathematical analysis works equally well to ...
The characteristic length in most relevant problems becomes the heat characteristic length, i.e. the ratio between the body volume and the heated (or cooled) surface of the body: = Here, the subscript Q, for heat, is used to denote that the surface to be considered is only the portion of the total surface through which the heat passes.
A fundamental solution, also called a heat kernel, is a solution of the heat equation corresponding to the initial condition of an initial point source of heat at a known position. These can be used to find a general solution of the heat equation over certain domains; see, for instance, for an introductory treatment.
Thermal contact resistance is significant and may dominate for good heat conductors such as metals but can be neglected for poor heat conductors such as insulators. [2] Thermal contact conductance is an important factor in a variety of applications, largely because many physical systems contain a mechanical combination of two materials.
Heat Conduction. Taylor and Francis. 2012. ISBN 9781466507845. Jan Taler, Piotr Duda. Solving Direct and Inverse Heat Conduction Problems. Springer-Verlag Berlin Heidelberg 2005. ISBN 978-3-540-33470-5. Liqiu Wang, Xuesheng Zhou, Xiaohao Wei. Heat Conduction: Mathematical Models and Analytical Solutions. Springer 2008. ISBN 978-3-540-74028-5.
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.