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2. Printed circuit board - Wikipedia

   en.wikipedia.org/wiki/Printed_circuit_board

   Manufacturers may not support component-level repair of printed circuit boards because of the relatively low cost to replace compared with the time and cost of troubleshooting to a component level. In board-level repair, the technician identifies the board (PCA) on which the fault resides and replaces it.

3. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Reflowing as a rework technique, similar to the manufacturing process of reflow soldering, involves dismantling the equipment to remove the faulty circuit board, pre-heating the whole board in an oven, heating the non-functioning component further to melt the solder, then cooling, following a carefully determined thermal profile, and ...

4. Level of Repair Analysis - Wikipedia

   en.wikipedia.org/wiki/Level_of_Repair_Analysis

   For a complex engineering system containing thousands of assemblies, sub-assemblies, components, organized into several levels of indenture and with a number of possible repair decisions, LORA seeks to determine an optimal provision of repair and maintenance facilities to minimize overall system life-cycle costs.

5. Computer maintenance - Wikipedia

   en.wikipedia.org/wiki/Computer_maintenance

   Internal components accumulate dust brought in by the airflow maintained by fans to keep the PC from overheating. A soft brush may remove loose dirt; the remainder is dislodged with compressed air and removed with a low-pressure vacuum. The case is wiped down with a cleaning agent.

6. Field-replaceable unit - Wikipedia

   en.wikipedia.org/wiki/Field-replaceable_unit

   3.5" Floppy disk drive by Alps Electric with FRU number A field-replaceable unit (FRU) [1] is a printed circuit board, part, or assembly that can be quickly and easily removed from a computer or other piece of electronic equipment, and replaced by the user or a technician without having to send the entire product or system to a repair facility.

7. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Manual prototype assembly or component-level repair is more difficult and requires skilled operators and more expensive tools, due to the small sizes and lead spacings of many SMDs. [17] Handling of small SMT components can be difficult, requiring tweezers, unlike nearly all through-hole components.

8. Mean time between failures - Wikipedia

   en.wikipedia.org/wiki/Mean_time_between_failures

   With parallel components the situation is a bit more complicated: the whole system will fail if and only if after one of the components fails, the other component fails while the first component is being repaired; this is where MDT comes into play: the faster the first component is repaired, the less is the "vulnerability window" for the other ...

9. Failure of electronic components - Wikipedia

   en.wikipedia.org/wiki/Failure_of_electronic...

   Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause ...