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The epoxy value is defined as the number of moles of epoxy group per 100g resin. So as an example using an epoxy resin with molar mass of 382 and that has 2 moles of epoxy groups per mole of resin, the EEW = 382/2 = 191, and the epoxy value is calculated as follows: 100/191 = 0.53 (i.e. the epoxy value of the resin is 0.53). [6]
Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called epoxy. [1] The IUPAC name for an epoxide group is an oxirane.
SU-8 is a commonly used epoxy-based negative photoresist. Negative refers to a photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development. As shown in the structural diagram, SU-8 derives its name from the presence of 8 epoxy groups.
FR-4 epoxy resin systems typically employ bromine, a halogen, to facilitate flame-resistant properties in FR-4 glass epoxy laminates. Some applications where thermal destruction of the material is a desirable trait [ citation needed ] will still use G-10 non flame resistant .
The second most important part of FBE coatings is the curing agent or hardener. Curing agents react either with the epoxy ring or with the hydroxyl groups, along the epoxy molecular chain. Various types of curing agents, used in FBE manufacture, include dicyandiamide, aromatic amines, aliphatic diamines and organic acid anhydrides. [6]
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A compound containing the epoxide functional group can be called an epoxy, epoxide, oxirane, and ethoxyline. Simple epoxides are often referred to as oxides. Thus, the epoxide of ethylene (C 2 H 4) is ethylene oxide (C 2 H 4 O). Many compounds have trivial names; for instance, ethylene oxide is called "oxirane".
Pour over bottom layer; smooth top. Refrigerate fudge until set, at least 2 hours and up to 5 days. Using parchment overhang, lift out fudge and transfer to a cutting board.
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