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2. Fiberglass - Wikipedia

   en.wikipedia.org/wiki/Fiberglass

   A suitable resin for combining the fiberglass with a plastic to produce a composite material was developed in 1936 by DuPont. The first ancestor of modern polyester resins is Cyanamid's resin of 1942. Peroxide curing systems were used by then. [6] With the combination of fiberglass and resin the gas content of the material was replaced by plastic.

3. Fibre-reinforced plastic - Wikipedia

   en.wikipedia.org/wiki/Fibre-reinforced_plastic

   A suitable resin for combining the "fibreglas" with a plastic to produce a composite material, was developed in 1936 by du Pont. The first ancestor of modern polyester resins is Cyanamid's resin of 1942. Peroxide curing systems were used by then. [6] With the combination of fibreglas and resin the gas content of the material was replaced by ...

4. Glass-filled polymer - Wikipedia

   en.wikipedia.org/wiki/Glass-filled_polymer

   Glass-filled polymer (or glass-filled plastic), is a mouldable composite material.It comprises short glass fibers in a matrix of a polymer material. It is used to manufacture a wide range of structural components by injection or compression moulding. [1]

5. Fiber-reinforced composite - Wikipedia

   en.wikipedia.org/wiki/Fiber-reinforced_composite

   A fiber-reinforced composite (FRC) is a composite building material that consists of three components: [1] [2]. the fibers as the discontinuous or dispersed phase, the matrix as the continuous phase, and

6. Fiberglass spray lay-up process - Wikipedia

   en.wikipedia.org/wiki/Fiberglass_spray_lay-up...

   The difference comes from the application of the fibre and resin material to the mould. Spray-up is an open-moulding composites fabrication process where resin and reinforcements are sprayed onto a reusable mould. The resin and glass may be applied separately or simultaneously "chopped" in a combined stream from a chopper gun.

7. Potting (electronics) - Wikipedia

   en.wikipedia.org/wiki/Potting_(electronics)

   A small transformer potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box. In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound.