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  2. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    There is a wide variety of cleaning agents for these fluxes. A no-clean flux is designed to leave only small amounts of inert flux residues. No-clean pastes save not only cleaning costs, but also capital expenditures and floor space. However, these pastes need a very clean assembly environment and may need an inert reflow environment.

  3. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    No-clean flux residue is acceptable on all 3 classes of PCBs as defined by IPC-610 provided it does not inhibit visual inspection, access to test points, or have a wet, tacky or excessive residue that may spread onto other areas. Connector mating surfaces must also be free of flux residue. Fingerprints in no-clean residue are a class 3 defect [19]

  4. Flux (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Flux_(metallurgy)

    Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

  5. Soldering iron - Wikipedia

    en.wikipedia.org/wiki/Soldering_iron

    For lead-free solder a slightly more aggressive cleaning, with brass shavings, can be used. Soldering flux will help to remove oxide; the more active the flux the better the cleaning, although acidic flux used on circuit boards that is not carefully cleaned off will cause corrosion. A tip which is cleaned but not retinned is susceptible to ...

  6. Hot air solder leveling - Wikipedia

    en.wikipedia.org/wiki/Hot_air_solder_leveling

    HASL or HAL (for hot air (solder) leveling) is a type of finish used on printed circuit boards (PCBs).. The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder.

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