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  2. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless nickel plating ...

  3. Gold plating - Wikipedia

    en.wikipedia.org/wiki/Gold_plating

    The thickness of gold plating on jewellery is noted in microns (or micro-meters). The microns of thickness determines how long the gold plating lasts with usage. The jewellery industry denotes different qualities of gold plating in the following terminology Gold flashed / Gold washed - gold layer thickness less than 0.5 micron

  4. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    Printed circuit board of a DVD player. Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and some electronic components mounted using through-hole mounting. A printed circuit board (PCB), also called printed wiring board (PWB), is a medium ...

  5. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Machine parts with electroless nickel plating. Electroless nickel-phosphorus plating, also referred to as E-nickel, is a chemical process that deposits an even layer of nickel - phosphorus alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a ...

  6. Wire bonding - Wikipedia

    en.wikipedia.org/wiki/Wire_bonding

    Wire bonding. The interconnections in a power package are made using thick (250 to 400 μm), wedge-bonded, aluminium wires. Inside a wire-bonded BGA package. This package has an Nvidia GeForce 256 GPU. Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during ...

  7. Electroless deposition - Wikipedia

    en.wikipedia.org/wiki/Electroless_deposition

    Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [19]

  8. Wire wrap - Wikipedia

    en.wikipedia.org/wiki/Wire_wrap

    The sockets have square posts. The usual posts are 0.025 in (0.64 mm) square, 1 in (25.4 mm) high, and spaced at 0.1 in (2.54 mm) intervals. Premium posts are hard-drawn beryllium copper alloy plated with a 0.000025 in (630 nm) of gold to prevent corrosion. Less-expensive posts are bronze with tin plating.

  9. Conformal coating - Wikipedia

    en.wikipedia.org/wiki/Conformal_coating

    Conformal coating is a protective, breathable coating of thin polymeric film applied to printed circuit boards (PCBs). Conformal coatings are typically applied with 25–250 μm [1] thickness on electronic circuitry to protect against moisture and other substances. Coatings can be applied in many ways, including brushing, spraying, dispensing ...

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