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Parts Average Testing is a statistical method for recognizing and quarantining semiconductor die that have a higher probability of reliability failures. This technique identifies characteristics that are within specification but outside of a normal distribution for that population as at-risk outliers not suitable for high reliability applications.
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals.
The goal of HALT is to proactively find weaknesses and fix them, thereby increasing product reliability. Because of its accelerated nature, HALT is typically faster and less expensive than traditional testing techniques. HALT is a test technique called test-to-fail, where a product is tested until failure. HALT does not help to determine or ...
In semiconductor devices, parasitic structures, irrelevant for normal operation, become important in the context of failures; they can be both a source and protection against failure. Applications such as aerospace systems, life support systems, telecommunications, railway signals, and computers use great numbers of individual electronic ...
Power-Constrained Testing of VLSI Circuits. A Guide to the IEEE 1149.4 Test Standard (Frontiers in Electronic Testing) by Nicola Nicolici and Bashir M. Al-Hashimi (Kindle Edition – Feb 28, 2003) ISBN 978-0-306-48731-6; Semiconductor Memories: Technology, Testing, and Reliability by Ashok K. Sharma (Hardcover – Sep 9, 2002) ISBN 978-0780310001
Accelerated life testing is the process of testing a product by subjecting it to conditions (stress, strain, temperatures, voltage, vibration rate, pressure etc.) in excess of its normal service parameters in an effort to uncover faults and potential modes of failure in a short amount of time.
Cole, E. I; Tangyunyong, P; Barton, D.L (1998), "Backside Localization of Open and Shorted IC Interconnections", 36th Annual International Reliability Physics Symposium, The Electron Device Society and the Reliability Society of the Institute of Electrical and Electronics Engineers, Inc.: 129– 136, ISBN 0-7803-4400-6.
Semiconductor characterization techniques are used to characterize a semiconductor material or device (p–n junction, Schottky diode, solar cell, etc.).Some examples of semiconductor properties that could be characterized include the depletion width, carrier concentration, carrier generation and recombination rates, carrier lifetimes, defect concentration, and trap states.