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Processors made on the Zen architecture are built on the 14 nm FinFET node and have a renewed focus on single-core performance and HSA compatibility. [180] Previous processors from AMD were either built in the 32 nm process ("Bulldozer" and "Piledriver" CPUs) or the 28 nm process ("Steamroller" and "Excavator" APUs).
Llano AMD Fusion (K10 cores + Redwood-class GPU) (launch Q2 2011, this is the first AMD APU) uses Socket FM1 Bulldozer architecture; Bulldozer, Piledriver, Steamroller, Excavator (2011–2017) [ edit ]
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. Fabrication process: TSMC 7FF. Bundled with AMD Wraith Stealth; The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2 ...
AMD announced a new series of processors on December 13, 2016, named "Ryzen", and delivered them in Q1 2017, [4] the first of several generations. The 1000 series featured up to eight cores and sixteen threads, with a +52 percent instructions per cycle (IPC) increase over their prior CPU products, namely AMD's previous Excavator microarchitecture.
List of AMD microprocessors; List of AMD CPU microarchitectures; List of AMD mobile microprocessors; List of AMD Athlon microprocessors; List of AMD Athlon XP microprocessors
AMD Family 11h – combined elements of K8 and K10 designs for Turion X2 Ultra / Puma mobile platform. AMD Fusion Family 12h – based on the 10h/K10 design. Includes CPU cores, GPU and Northbridge in the same chip. Llano was the first design which implemented it. Fusion was later re-branded as the APU.
The original Zen and the Zen+ CPUs are of a monolithic design which were produced at GlobalFoundries facilities in Malta, NY. Going forward, AMD pursued a chiplet design with the Zen 2 series. Zen 2 desktop and server processors consist of a 14/12 nm manufactured I/O die surrounded by a number of 7 nm core dies.
TSMC was the first foundry to market 7-nanometre and 5-nanometre (used by the 2020 Apple A14 and M1 SoCs, the MediaTek Dimensity 8100, and AMD Ryzen 7000 series processors) production capabilities, and the first to commercialize ASML's extreme ultraviolet (EUV) lithography technology in high volume.
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