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  2. Etching (microfabrication) - Wikipedia

    en.wikipedia.org/wiki/Etching_(microfabrication)

    Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which ...

  3. Silicon nanowire - Wikipedia

    en.wikipedia.org/wiki/Silicon_nanowire

    Silicon nanowires, also referred to as SiNWs, are a type of semiconductor nanowire most often formed from a silicon precursor by etching of a solid or through catalyzed growth from a vapor or liquid phase. Such nanowires have promising applications in lithium-ion batteries, thermoelectrics and sensors. Initial synthesis of SiNWs is often ...

  4. Plasma etching - Wikipedia

    en.wikipedia.org/wiki/Plasma_etching

    A plasma etcher, or etching tool, is a tool used in the production of semiconductor devices. A plasma etcher produces a plasma from a process gas, typically oxygen or a fluorine -bearing gas, using a high frequency electric field, typically 13.56 MHz. A silicon wafer is placed in the plasma etcher, and the air is evacuated from the process ...

  5. Reactive-ion etching - Wikipedia

    en.wikipedia.org/wiki/Reactive-ion_etching

    A reactive-ion etching setup in a laboratory cleanroom. Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum ...

  6. Grain boundary - Wikipedia

    en.wikipedia.org/wiki/Grain_boundary

    In materials science, a grain boundary is the interface between two grains, or crystallites, in a polycrystalline material. Grain boundaries are two-dimensional defects in the crystal structure, and tend to decrease the electrical and thermal conductivity of the material. Most grain boundaries are preferred sites for the onset of corrosion [1 ...

  7. Dry etching - Wikipedia

    en.wikipedia.org/wiki/Dry_etching

    Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface.

  8. Quantum dot - Wikipedia

    en.wikipedia.org/wiki/Quantum_dot

    Quantum dots defined by lithographically patterned gate electrodes, or by etching on two-dimensional electron gases in semiconductor heterostructures can have lateral dimensions between 20 and 100 nm. Some quantum dots are small regions of one material buried in another with a larger band gap.

  9. Nanowire - Wikipedia

    en.wikipedia.org/wiki/Nanowire

    Portals. Electronics portal. v. t. e. A nanowire is a nanostructure in the form of a wire with the diameter of the order of a nanometre (10 −9 m). More generally, nanowires can be defined as structures that have a thickness or diameter constrained to tens of nanometers or less and an unconstrained length.