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Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
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Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...
The most common dip soldering operations use zinc-aluminum and tin-lead solders. Solder pot metal: cast iron or steel, electrically heated. Bath temperature: 220 to 260 °C (for binary tin-lead alloys) or 350 to 400 °C (for lead-free alloys) Solder composition: 60% Sn, 40% Pb or eutectic alloy.
Common solder alloys include tin-lead, tin-silver, and tin-copper, among others. Lead-free solder has also become more widely used in recent years due to health and environmental concerns associated with the use of lead. In addition to the type of solder used, the temperature and method of heating also play a crucial role in the soldering process.
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Solderability when using lead-free alloys can differ significantly from solderability when using lead based alloys. Noble metals may be easy to solder but they have brittle joints. The metals in the good category require a large amount of heat therefore oxidation is an issue. To overcome this a flux is required.