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The main ingredients of an electroless nickel plating bath are source of nickel cations Ni 2+, usually nickel sulfate and a suitable reducing agent, such as hypophosphite H 2 PO − 2 or borohydride BH − 4. [1] With hypophosphite, the main reaction that produces the nickel plating yields orthophosphite H 2 PO − 3, elemental phosphorus ...
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
Black nickel plating was developed around 1905, and between the two wars, black chrome plating (first German patent 1929.GP 607, 420), which saw wider use only from the mid-1950s. [14] After the First World War, the first procedures for anodic oxidation and coloring of anodically oxidized aluminium were developed (1923, 1924.DRP. 413876).
"Black nickel" is a dark coating that consists primarily of nickel sulfide and metallic zinc and nickel. [14] It is typically plated on brass, bronze, or steel in order to produce a non-reflective surface. [15] This type of plating is used for decorative and military purposes and does not offer much protection. [1] [2] [15]
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]
Nickel plating may refer to: Nickel electroplating , a technique of electroplating a thin layer of nickel onto a metal object Electroless nickel-phosphorus plating , an auto-catalytic chemical technique used to deposit a layer of nickel-phosphorus on a solid workpiece
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The Voiland College of Engineering and Architecture was established in 1917 as the College of Mechanical Arts and Engineering upon the reorganization of the State College of Washington, [1] but its roots trace back to the original establishment of Washington State University in 1890 that included a mechanical engineering program. [2]
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