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  2. Electrical discharge machining - Wikipedia

    en.wikipedia.org/wiki/Electrical_discharge_machining

    Electrical discharge machining (EDM), also known as spark machining, spark eroding, die sinking, wire burning or wire erosion, is a metal fabrication process whereby a desired shape is obtained by using electrical discharges (sparks). [1] Material is removed from the work piece by a series of rapidly recurring current discharges between two ...

  3. Wire drawing - Wikipedia

    en.wikipedia.org/wiki/Wire_drawing

    Wire drawing is a metalworking process used to reduce the cross-section of a wire by pulling the wire through one or more dies. There are many applications for wire drawing, including electrical wiring, cables, tension-loaded structural components, springs, paper clips, spokes for wheels, and stringed musical instruments.

  4. Drawing (manufacturing) - Wikipedia

    en.wikipedia.org/wiki/Drawing_(manufacturing)

    Drawing is a manufacturing process that uses tensile forces to elongate metal, glass, or plastic. As the material is drawn (pulled), it stretches and becomes thinner, achieving a desired shape and thickness. Drawing is classified into two types: sheet metal drawing and wire, bar, and tube drawing. Sheet metal drawing is defined as a plastic ...

  5. Wire - Wikipedia

    en.wikipedia.org/wiki/Wire

    A wire is a flexible, round, bar of metal. wires are commonly formed by drawing the metal through a hole in a die or draw plate. Wire gauges come in various standard sizes, as expressed in terms of a gauge number or cross-sectional area. Wires are used to bear mechanical loads, often in the form of wire rope.

  6. Wire bonding - Wikipedia

    en.wikipedia.org/wiki/Wire_bonding

    Wire bonding. The interconnections in a power package are made using thick (250 to 400 μm), wedge-bonded, aluminium wires. Inside a wire-bonded BGA package. This package has an Nvidia GeForce 256 GPU. Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during ...

  7. Hairpin technology - Wikipedia

    en.wikipedia.org/wiki/Hairpin_technology

    In the first process, a flat copper wire, which is usually already enameled, is continuously unwound and straightened in several stages to reduce residual curvature and stresses. In preparation for welding of the copper ends in a later process step, this insulation is partially removed. Laser-based and mechanical processes are feasible. The ...

  8. Coil winding technology - Wikipedia

    en.wikipedia.org/wiki/Coil_winding_technology

    hide. In electrical engineering, coil winding is the manufacture of electromagnetic coils. Coils are used as components of circuits, and to provide the magnetic field of motors, transformers, and generators, and in the manufacture of loudspeakers and microphones. The shape and dimensions of a winding are designed to fulfill the particular purpose.

  9. Potting (electronics) - Wikipedia

    en.wikipedia.org/wiki/Potting_(electronics)

    Potting (electronics) A small transformer potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box. In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound. This is done to exclude water, moisture, or corrosive ...

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