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  2. KLA Corporation - Wikipedia

    en.wikipedia.org/wiki/KLA_Corporation

    In January 2008, KLA paid $65 million to settle allegations that the company and certain executives had illegally backdated stock option grants. [30] The U.S. Securities and Exchange Commission stated that "KLA dramatically overstated its reported financial results, depriving investors of accurate information about the company's compensation costs and financial performance.

  3. List of S&P 500 companies - Wikipedia

    en.wikipedia.org/wiki/List_of_S&P_500_companies

    The S&P 500 is a stock market index maintained by S&P Dow Jones Indices. It comprises 503 common stocks which are issued by 500 large-cap companies traded on the American stock exchanges (including the 30 companies that compose the Dow Jones Industrial Average ).

  4. Onto Innovation - Wikipedia

    en.wikipedia.org/wiki/Onto_Innovation

    Onto Innovation Inc. is an American semiconductor company formed in 2019 from the merger of Rudolph Technologies, Inc. and Nanometrics Incorporated. It is a provider of process and process control equipment and software for microelectronic manufacturing industries (primarily semiconductor device manufacturing).

  5. Rudolph Enters Back-End Lithography Market with Breakthrough ...

    www.aol.com/news/2012-12-12-rudolph-enters-back...

    The Azores acquisition uniquely positions Rudolph in the back-end stepper advanced packaging photolithography market with a significantly expanded business model, and we believe that by offering ...

  6. ASE Group - Wikipedia

    en.wikipedia.org/wiki/ASE_Group

    Wafer-level chip-scale packaging (WL-CSP) is the technology that enables the smallest available packages in the market, meeting the increasing demand for smaller and faster portable consumer devices. This ultra-thin package type has integrated into mobile devices such as smartphones. [ 12 ]

  7. Advanced packaging (semiconductors) - Wikipedia

    en.wikipedia.org/wiki/Advanced_packaging...

    Advanced packaging [1] is the aggregation and interconnection of components before traditional integrated circuit packaging where a single die is packaged. Advanced packaging allows multiple devices, including electrical, mechanical, or semiconductor devices, to be merged and packaged as a single electronic device.

  8. US plans $75 million grant to Absolics for advanced chip ...

    www.aol.com/news/us-plans-75-million-grant...

    The US Commerce Department said on Thursday it plans to grant $75 million to Absolics for constructing a 120,000-square-foot facility in Georgia that will supply advanced materials to the country ...

  9. Amkor Technology - Wikipedia

    en.wikipedia.org/wiki/Amkor_Technology

    Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Arizona , since 2005, when it was moved from West Chester , Pennsylvania , also in the United States . [ 5 ]