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E.C Electroplating went out of business in 2009, leaving the Superfund site “orphaned” as there was no longer a responsible party to pay for the clean-up. In 2016, the EPA estimated that the cleanup for the E.C Electroplating site and surrounding areas would cost around $37 million. [12] [13]
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
Plating equipment evolved from manually-operated tar-lined wooden tanks to automated equipment capable of processing thousands of kilograms per hour of parts. One of the American physicist Richard Feynman's first projects was to develop technology for electroplating metal onto plastic. Feynman developed the original idea of his friend into a ...
Immersion zinc plating is an electroless (non-electrolytic) coating process that deposits a thin layer of zinc on a less electronegative metal, by immersion in a solution containing a zinc or zincate ions, Zn(OH) 2− 4. A typical use is plating aluminum with zinc prior to electrolytic or electroless nickel plating.
Mechanical plating, also known as peen plating, mechanical deposition, or impact plating, is a plating process that imparts the coating by cold welding fine metal particles to a workpiece. Mechanical galvanization is the same process, but applies to coatings that are thicker than 0.001 in (0.025 mm). [ 1 ]
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Such zinc electroplating or zinc alloy electroplating maintains a dominant position among other electroplating process options, based upon electroplated tonnage per annum. According to the International Zinc Association, more than 5 million tons are used yearly for both hot-dip galvanization and electroplating. [ 1 ]
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