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SMTC Corporation (Surface Mount Technology Centre), founded in 1985, is a mid-size provider of end-to-end electronics manufacturing services (EMS) including PCBA production, systems integration and comprehensive testing services, enclosure fabrication, as well as product design, sustaining engineering and supply chain management services.
Surface-mount technology was developed in the 1960s. By 1986, surface-mounted components accounted for 10% of the market at most but were rapidly gaining popularity. [4] By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices.
Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate.
Surface mount components are placed along the front (and often back) faces of the machine. Most components are supplied on paper or plastic tape, in tape reels that are loaded onto feeders mounted to the machine. Larger integrated circuits (ICs) are sometimes supplied and arranged in trays which are stacked in a compartment. More commonly used ...
Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. The main manufacturing technique is screen printing ( stenciling ), which in addition to use in manufacturing electronic devices can also be used for ...
Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology (SMT) components to a printed circuit board (PCB). Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly.
Populated (rear) and unpopulated (front) TSOP land patterns on a printed circuit board. A row of through-holes acting as the footprint for a pin header.. A footprint or land pattern is the arrangement of pads (in surface-mount technology) [1] or through-holes (in through-hole technology) used to physically attach and electrically connect a component to a printed circuit board.
SMEMA is an acronym for the Surface Mount Equipment Manufacturers Association.. In 1999 they merged with the IPC to form the IPC SMEMA Council. [1]One standard they have is for the wiring of communications between Surface mount technology producing machinery such as a Stencil Printer or a Pick and Place Machine on an Electronics production line.