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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Although solder paste typically contains around 90% metal in solids by weight, the volume of the soldered joint is only about half that of the solder paste applied. [7] This is due to the presence of flux and other non-metallic agents in the paste, and the lower density of the metal particles when suspended in the paste as compared to the final ...

3. Flux (metallurgy) - Wikipedia

   en.wikipedia.org/wiki/Flux_(metallurgy)

   Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

4. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder powder and a flux-vehicle that has a peanut butter-like consistency [8]) is used to stick the components to their attachment pads, after which the assembly is heated by an infrared lamp, a hot air pencil, or, more commonly, by passing it through a carefully ...

5. Reflow soldering - Wikipedia

   en.wikipedia.org/wiki/Reflow_soldering

   Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...

6. Stencil printing - Wikipedia

   en.wikipedia.org/wiki/Stencil_Printing

   Ideally, a solder paste should have, at minimum, a 4-hour stencil life. The stencil life is defined as a time period in which there will be no significant change in the solder paste material characteristics. A solder paste with a longer stencil life will be more robust in the printing process.

7. Head-in-pillow defect - Wikipedia

   en.wikipedia.org/wiki/Head-in-pillow_defect

   The solder paste composition, eg. flux with higher activation temperature, together with the wetting characteristics of the solder ball, are the most significant mitigation factors. [1] Since the warping of the circuit board or integrated circuit may disappear when the board cools, an intermittent fault may be created.