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Populated (rear) and unpopulated (front) TSOP land patterns on a printed circuit board. A row of through-holes acting as the footprint for a pin header.. A footprint or land pattern is the arrangement of pads (in surface-mount technology) [1] or through-holes (in through-hole technology) used to physically attach and electrically connect a component to a printed circuit board.
Surface-mount technology was developed in the 1960s. By 1986, surface-mounted components accounted for 10% of the market at most but were rapidly gaining popularity. [4] By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices.
Polaroid Zink printer Dell Wasabi PZ310 Zink printer Polaroid Socialmatic Zink camera. Zink (stylised as ZINK, a portmanteau of zero and ink) is a full-color printing technology [1] for digital devices that does not require ink cartridges and prints in a single pass.
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
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Some QFP packages have an exposed pad. The exposed pad is an extra pad underneath or on top of the QFP that may act as a ground connection and/or as a heat sink for the package. The pad is typically 10 or more mm 2, and with the pad soldered down onto the ground plane, heat is passed into the PCB. This exposed pad also gives a solid ground ...
Intel Mobile Celeron in a flip-chip BGA package (FCBGA-479); the BGA package substrate or flip chip substrate, also called a BGA or flip chip interposer, is dark yellow, and the silicon die appears dark blue Underside of a die from a flip chip package, the top metal layer on the IC die or top metallization layer, and metallized pads for flip chip mounting are visible
Ground pressure is the pressure exerted on the ground by the tires or tracks of a motorized vehicle, and is one measure of its potential mobility, [1] especially over soft ground.
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