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  2. DDR3 SDRAM - Wikipedia

    en.wikipedia.org/wiki/DDR3_SDRAM

    Compared to DDR2 memory, DDR3 memory uses less power. Some manufacturers further propose using "dual-gate" transistors to reduce leakage of current. [10]According to JEDEC, [11]: 111 1.575 volts should be considered the absolute maximum when memory stability is the foremost consideration, such as in servers or other mission-critical devices.

  3. DDR SDRAM - Wikipedia

    en.wikipedia.org/wiki/DDR_SDRAM

    These two specifications are notched very similarly and care must be taken during insertion if unsure of a correct match. Most DDR SDRAM operates at a voltage of 2.5 V, compared to 3.3 V for SDRAM. This can significantly reduce power consumption. Chips and modules with the DDR-400/PC-3200 standard have a nominal voltage of 2.6 V.

  4. JEDEC memory standards - Wikipedia

    en.wikipedia.org/wiki/JEDEC_memory_standards

    The Joint Electron Device Engineering Council characterizes its standardization efforts as follows: [1] JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the ...

  5. DDR4 SDRAM - Wikipedia

    en.wikipedia.org/wiki/DDR4_SDRAM

    The primary advantages of DDR4 over its predecessor, DDR3, include higher module density and lower voltage requirements, coupled with higher data rate transfer speeds. The DDR4 standard allows for DIMMs of up to 64 GB in capacity, compared to DDR3's maximum of 16 GB per DIMM.

  6. USB-C - Wikipedia

    en.wikipedia.org/wiki/USB-C

    USB-C plug USB-C (SuperSpeed USB 5Gbps) receptacle on an MSI laptop. USB-C, or USB Type-C, is a 24-pin connector (not a protocol) that supersedes previous USB connectors and can carry audio, video, and other data, to connect to monitors or external drives.

  7. USB - Wikipedia

    en.wikipedia.org/wiki/USB

    USB 3.0 and later specifications define one dedicated pair for USB 2.0 compatibility and two or four pairs for data transfer: two data wire pairs realising full-duplex (FDx) for single lane (×1) variants require at least SuperSpeed (SS) connectors; four pairs realising full-duplex for two lane (×2) variants require USB-C connectors.

  8. Xbox 360 technical specifications - Wikipedia

    en.wikipedia.org/wiki/Xbox_360_technical...

    The Xbox 360 technical specifications describe the various components of the Xbox 360 video game console.. The console features a port on the top when vertical (left side when horizontal) to which a custom-housed hard disk drive unit can be attached in sizes of either 20, 60, 120, 250, 320, 500 GB; [1] and as of April 2015 all 2.5" SATA Hard Drives up to 2 TB, [2] [3] the user can use the ...

  9. GameCube technical specifications - Wikipedia

    en.wikipedia.org/wiki/GameCube_technical...

    The console's technical specifications are as follows. [2] [3] [4] IBM PowerPC "Gekko" processor IBM PowerPC "Gekko" processor (180 nm) shaven down to show the silicon die ATi "Flipper" processor ATi "Flipper" (180 nm) shaven down to show the silicon die One of the two 1T-SRAM RAM modules shaven down to expose the die GameCube Game Disc