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  2. Solderability - Wikipedia

    en.wikipedia.org/wiki/Solderability

    Solderability when using lead-free alloys can differ significantly from solderability when using lead based alloys. Noble metals may be easy to solder but they have brittle joints. The metals in the good category require a large amount of heat therefore oxidation is an issue. To overcome this a flux is required.

  3. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 62 Pb 37 Cu 1: 183 [17] Pb: Yes: Similar to Sn 63 Pb 37. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 63 Pb 37 P 0.0015-0.04: 183 ...

  4. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Common solder alloys include tin-lead, tin-silver, and tin-copper, among others. Lead-free solder has also become more widely used in recent years due to health and environmental concerns associated with the use of lead. In addition to the type of solder used, the temperature and method of heating also play a crucial role in the soldering process.

  5. Soldering iron - Wikipedia

    en.wikipedia.org/wiki/Soldering_iron

    Few years later, they released to the market a soldering iron on with self-adjusting temperature. In 1951, the company WEN Products began manufacturing its own instantaneous soldering iron. After a three years trial Weller won for patent infringement. [11] In 1960 Weller got the patent for the soldering iron "Magnastat", renewed in 1964 and ...

  6. Dip soldering - Wikipedia

    en.wikipedia.org/wiki/Dip_soldering

    The most common dip soldering operations use zinc-aluminum and tin-lead solders. Solder pot metal: cast iron or steel, electrically heated. Bath temperature: 220 to 260 °C (for binary tin-lead alloys) or 350 to 400 °C (for lead-free alloys) Solder composition: 60% Sn, 40% Pb or eutectic alloy.

  7. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]

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