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2. Thin small outline package - Wikipedia

   en.wikipedia.org/wiki/Thin_small_outline_package

   Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume.

3. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008). Exceptions occur for imperial in the two smallest rectangular passive sizes. The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned.

4. Ball grid array - Wikipedia

   en.wikipedia.org/wiki/Ball_grid_array

   A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.

5. Motherboard form factor - Wikipedia

   en.wikipedia.org/wiki/Motherboard_form_factor

   Functionally equivalent to the AT, it became popular due to its significantly smaller size. ATX: Intel: 1995 305 × 244 mm (12 × 9.6 in) Created by Intel in 1995. As of 2017, it is the most popular form factor for commodity motherboards. Typical size is 9.6 × 12 in although some companies extend that to 10 × 12 in. SSI CEB: SSI?

6. Solder ball - Wikipedia

   en.wikipedia.org/wiki/Solder_ball

   The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] Ball grid array, chip-scale package, and flip chip packages generally use solder balls.

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