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  2. Head-in-pillow defect - Wikipedia

    en.wikipedia.org/wiki/Head-in-pillow_defect

    In the assembly of integrated circuit packages to printed circuit boards, a head-in-pillow defect (HIP or HNP), also called ball-and-socket, [1] is a failure of the soldering process. For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may ...

  3. Proline - Wikipedia

    en.wikipedia.org/wiki/Proline

    Furthermore, proline is rarely found in α and β structures as it would reduce the stability of such structures, because its side chain α-nitrogen can only form one nitrogen bond. Additionally, proline is the only amino acid that does not form a red-purple colour when developed by spraying with ninhydrin for uses in chromatography. Proline ...

  4. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...

  5. Piping and plumbing fitting - Wikipedia

    en.wikipedia.org/wiki/Piping_and_plumbing_fitting

    The welding of metals differs from soldering and brazing in that the joint is made without adding a lower-melting-point material (e.g. solder); instead, the pipe or tubing material is partially melted, and the fitting and piping are directly fused. This generally requires piping and fitting to be the same (or compatible) material.

  6. Social media reacts to ESPN's focus on Parker Jones penalty ...

    www.aol.com/social-media-reacts-espns-focus...

    Social media criticized ESPN for its focus on Georgia's Parker Jones after his sideline interference penalty in the CFP Sugar Bowl quarterfinal game:

  7. Dye-and-pry - Wikipedia

    en.wikipedia.org/wiki/Dye-and-Pry

    Dye-n-Pry is a useful failure analysis technique to detect cracking or open circuits in BGA solder joints. [2] This has some practical advantages over other destructive techniques, such as cross sectioning, as it can inspect a full ball grid array which may consist of hundreds of solder joints. Cross sectioning, on the other hand, may only be ...

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