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Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.
Used with flux. Unsuitable for vacuum brazing due to high zinc content. Worse corrosion resistance due to higher alloying. Tendency to liquation, has to be heated rapidly through the melting range. Grayish-white color. 4: 10: 76: 10: Zn 98 Al 2: 382/392 [4] – AL 802. General purpose filler metal for aluminium soldering/brazing with a torch ...
Soldering copper pipes using a propane torch and a lead-free solder Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point , chemical reactivity, mechanical properties, toxicity, and other properties.
The flux also serves the purpose of cleaning any contamination left on the brazing surfaces. Flux can be applied in any number of forms including flux paste, liquid, powder or pre-made brazing pastes that combine flux with filler metal powder. Flux can also be applied using brazing rods with a coating of flux, or a flux core.
A soldering iron stand keeps the iron away from flammable materials, and often also comes with a cellulose sponge and flux pot for cleaning the tip. Some soldering irons for continuous and professional use come as part of a soldering station, which allows the exact temperature of the tip to be adjusted, kept constant, and sometimes displayed.
Desoldering braid, also known as desoldering wick or solder wick, is finely braided 18 to 42 AWG copper wire coated with rosin flux, usually supplied on a roll. Solder wick, before use... and soaked with solder and residue. The end of a length of braid is placed over the soldered connections of a component being removed.
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
To obtain functional joints, the inside of the fitting and the outside of the copper pipe are cleaned using steel wool or cleaning tape, flux paste is applied, the pipe is inserted into the fitting and heat is applied from a portable butane torch or propane torch until a ring of solder shows at the edges of the fitting.
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