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2. Electroless copper plating - Wikipedia

   en.wikipedia.org/wiki/Electroless_copper_plating

   Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde .

3. Wikipedia : WikiProject Consumer Reports/Product reviews

   en.wikipedia.org/.../Product_reviews

   Consumer Reports is a United States-based non-profit organization which conducts product testing and product research to collect information to share with consumers so that they can make more informed purchase decisions in any marketplace.

4. Consumer Reports - Wikipedia

   en.wikipedia.org/wiki/Consumer_Reports

   Consumer Reports' flagship website and magazine publishes reviews and comparisons of consumer products and services based on reporting and results from its in-house testing laboratory and survey research center. CR accepts no advertising, pays for all the products it tests, and as a nonprofit organization has no shareholders.

5. Copper electroplating - Wikipedia

   en.wikipedia.org/wiki/Copper_electroplating

   Copper fluoroborate baths are similar to acid sulfate baths, but they use fluoroborate as the anion rather than sulfate. [6] Copper fluoroborate is much more soluble than copper sulfate, which allows one to dissolve larger quantities of copper salt into the bath, enabling much higher current densities than what is possible in copper sulfate baths.

6. Electroplating - Wikipedia

   en.wikipedia.org/wiki/Electroplating

   Simplified diagram for electroplating copper (orange) on a conductive object (the cathode, "Me", gray). The electrolyte is a solution of copper sulfate, CuSO 4 in sulfuric acid. A copper anode is used to replenish the electrolyte with copper cations Cu 2+ as they are plated out at the cathode.

7. Electroless deposition - Wikipedia

   en.wikipedia.org/wiki/Electroless_deposition

   Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]