Ads
related to: kerf width laser cutting
Search results
Results from the WOW.Com Content Network
Laser cutting is a technology that ... Depending upon the material thickness, kerf widths ... is limited by a number of factors including laser power, material ...
Defect regions of about 10 μm width are inscribed by multiple scans of the laser along the intended dicing lanes, where the beam is focused at different depths of the wafer. [7] The figure displays an optical micrograph of a cleavage plane of a separated chip of 150 μm thickness that was subjected to four laser scans, compare. [4]
where t is the depth of cut, P is the laser beam power, v is the cutting velocity, and d is the laser beam spot diameter. [5] The depth of the cut is also influenced by the workpiece material. The material's reflectivity, density, specific heat, and melting point temperature all contribute to the lasers ability to cut the workpiece.
EBM can be used for very precise cutting or boring of a wide variety of metals. Surface finish is better and kerf width is narrower than those for other thermal cutting processes. EBM process is best suitable for high melting point and high thermal conductivity materials. The EBM beam is operated in pulse mode.
The kerf, or width, of the cut can be adjusted by swapping parts in the nozzle, as well as changing the type and size of the abrasive. Typical abrasive cuts have a kerf in the range of 0.04 to 0.05 in (1.0–1.3 mm), but can be as narrow as 0.02 inches (0.51 mm).
The upper and lower diamond guides are usually accurate to 0.004 mm (0.16 mils), and can have a cutting path or kerf as small as 0.021 mm (0.83 mils) using Ø 0.02 mm (0.79 mils) wire, though the average cutting kerf that achieves the best economic cost and machining time is 0.335 mm (13.2 mils) using Ø 0.25 mm (9.8 mils) brass wire.
Ads
related to: kerf width laser cutting