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The cathode efficiency depends on the process and varies between 90 and 97%. Due to this mismatch, during the plating the nickel concentration in the solution and the pH will slowly rise. [6] The process takes minutes to hours depending on the current density and the intended thickness of the plating. [7]
The main ingredients of an electroless nickel plating bath are source of nickel cations Ni 2+, usually nickel sulfate and a suitable reducing agent, such as hypophosphite H 2 PO − 2 or borohydride BH − 4. [1] With hypophosphite, the main reaction that produces the nickel plating yields orthophosphite H 2 PO − 3, elemental phosphorus ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Electroless nickel plating, also known as enickel and NiP, offers many advantages: uniform layer thickness over most complicated surfaces, direct plating of ferrous metals (steel), superior wear and corrosion resistance compared to electroplated nickel or chrome. Much of the chrome plating done in aerospace industry can be replaced with ...
Initially, a special plating deposit called a strike or flash may be used to form a very thin (typically less than 0.1 μm thick) plating with high quality and good adherence to the substrate. This serves as a foundation for subsequent plating processes.
Electroless nickel plating uses nickel salts as the metal cation source and either hypophosphite (H 2 PO 2-) (or a borohydride-like compound) as a reducer. [5] A side reaction forms elemental phosphorus (or boron) which is incorporated in the coating. The classical deposition methods follows the following steps:
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