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Bioconcentration. In aquatic toxicology, bioconcentration is the accumulation of a water-borne chemical substance in an organism exposed to the water. [ 1][ 2] There are several ways in which to measure and assess bioaccumulation and bioconcentration. These include: octanol-water partition coefficients (K OW ), bioconcentration factors (BCF ...
The formulas are organized into tables in a hierarchical format: chapter, table, case, subcase, and each case and subcase is accompanied by diagrams. The main topics of the book include: • The behavior of bodies under stress • Analytical, numerical, and experimental methods • Tension, compression, shear, and combined stress
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals.
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Girard form class is the primary expression of tree form in the United States. To allow for log trimming and a 1-foot stump height the diameter inside bark is measured at 17.3 feet above the ground. The closer the form class value to 100 the closer the log resembles a cylinder, where a value of 100 means the log is very nearly a cylinder.
Exponential decay is a scalar multiple of the exponential distribution (i.e. the individual lifetime of each object is exponentially distributed), which has a well-known expected value. We can compute it here using integration by parts .
In thermodynamics, the Volume Correction Factor (VCF), also known as Correction for the effect of Temperature on Liquid (CTL), is a standardized computed factor used to correct for the thermal expansion of fluids, primarily, liquid hydrocarbons at various temperatures and densities. [1] It is typically a number between 0 and 2, rounded to five ...
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations, or mechanical loads. Techniques to evaluate solder fatigue behavior include finite element analysis and ...