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  2. Potting (electronics) - Wikipedia

    en.wikipedia.org/wiki/Potting_(electronics)

    In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound. This is done to exclude water, moisture, or corrosive agents, to increase resistance to shocks and vibrations, or to prevent gaseous phenomena such as corona discharge in high-voltage assemblies.

  3. Conformal coating - Wikipedia

    en.wikipedia.org/wiki/Conformal_coating

    Conformal coatings are used to protect electronic components from possible environmental exposure; they allow moisture to escape but protect against contamination. More recently, conformal coatings are being used to reduce the formation of whiskers [ 2 ] and to prevent current bleed between closely positioned components.

  4. Electrical enclosure - Wikipedia

    en.wikipedia.org/wiki/Electrical_enclosure

    Electro polished enclosure (control station), explosion-proof A municipal electrical enclosure Allen Bradley programmable logic controller (PLC) installed in an electrical enclosure An electrical enclosure is a cabinet for electrical or electronic equipment to mount switches , knobs and displays and to prevent electrical shock to equipment ...

  5. Electronic packaging - Wikipedia

    en.wikipedia.org/wiki/Electronic_packaging

    Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .

  6. Housing (engineering) - Wikipedia

    en.wikipedia.org/wiki/Housing_(engineering)

    A transparent plastic housing around an electronic device. In engineering, a housing or enclosure is a container, a protective exterior (e.g. shell) or an enclosing structural element (e.g. chassis or exoskeleton) designed to enable easier handling, provide attachment points for internal mechanisms (e.g. mounting brackets for electrical components, cables and pipings), maintain cleanliness of ...

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  9. Moisture sensitivity level - Wikipedia

    en.wikipedia.org/wiki/Moisture_sensitivity_level

    Moisture sensitivity levels are specified in technical standard IPC/JEDEC Moisture/reflow Sensitivity Classification for Nonhermetic Surface-Mount Devices. [1] The times indicate how long components can be outside of dry storage before they have to be baked to remove any absorbed moisture. MSL 6 – Mandatory bake before use; MSL 5A – 24 hours

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