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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors . A BGA can provide more interconnection pins than can be put on a dual in-line or flat package .
Initially, the impetus behind this recognition and the subsequent development of solutions was the emergence of new semiconductor chip packages such as the ball grid array (BGA) which placed the device's pins beneath the silicon die, making them inaccessible to physical contact with an instrument's or a test system's metal probes.
Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN , but mating is by spring pins within a socket rather than solder.
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
The next big innovation was the area array package, which places the interconnection terminals throughout the surface area of the package, providing a greater number of connections than previous package types where only the outer perimeter is used. The first area array package was a ceramic pin grid array package. [1]
A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [ 3 ] Ball grid array , chip-scale package , and flip chip packages generally use solder balls.
Package on a package (PoP) is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for discrete logic and memory.Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them.
The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale ...