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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
Its snap-on design offers a quick connect/disconnect. It features a reduced housing allowing circuit miniaturization and efficient use of space. They are available for several cable types as well as for PCB through hole, surface mount and end launch applications from several manufacturers, including Amphenol RF. MMCX connector; MMS connector
Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead. TAB: Tape-automated bonding: Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires. Used by LCD driver ICs. COG: Chip-on-glass
A variety of methods are used to attach an RF module to a printed circuit board, either with through-hole technology or surface-mount technology. Through-hole technology allows the module to be inserted or removed without soldering. Surface-mount technology allows the module to be attached to the PCB without an additional assembly step.
The 2N7002 variant is packaged in a TO-236 surface-mount package. The 2N7000 is an N-channel, enhancement-mode MOSFET used for low-power switching applications. [1] The 2N7000 is a widely available and popular part, often recommended as useful and common components to have around for hobbyist use. [2]
RF series is double row. [7] JST RE: EH [8] 2.50 mm (0.098 in) 1 . 3 . ... Some JST surface-mount headers are designed to handle higher temperatures of reflow soldering.
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